High-Frequency Transmission Line Connection Struct

专利名称：High-Frequency Transmission Line

Connection Structure, Circuit Board, High-Frequency Module, and Radar Apparatus

发明人：Kentaro Miyazato,Kazuki Hayata,Yuji Kishida申请号：US12681087申请日：20081227

公开号：US20100245155A1公开日：20100930

专利附图：

摘要：The invention relates to a high-frequency transmission line connectionstructure, a circuit board having the connection structure, a high-frequency module

having the circuit board, and a radar apparatus. A first laminated waveguide sub-line part() includes a pair of main conductor layers that oppose each other in a thickness directionwith a dielectric layer () having the same thickness as a dielectric layer () of a microstripline () interposed therebetween. A second laminated waveguide sub-line part () includesdielectric layers () thicker than the dielectric layer of the first laminated waveguide sub-line part (). A laminated waveguide main-line part () includes dielectric layers () thickerthan the dielectric layers of the second laminated waveguide sub-line part (). Aconversion part () connected to the microstrip line () is formed by integrating with anupper main conductor layer constituting the respective line parts.

申请人：Kentaro Miyazato,Kazuki Hayata,Yuji Kishida

地址：Kirishima-shi JP,Soraku-gun JP,Soraku-gun JP

国籍：JP,JP,JP

更多信息请下载全文后查看